Type of | DDR4 |
Purpose | For PC |
The volume of one module | 8 |
The number of modules | 2 |
Form factor | DIMM |
Frequency | 3600 |
CAS LATENCY (CL) | CL18 |
ECC memory | No ECC support |
XMP | XMP profile support |
Supply voltage | 1.35 |
Peculiarities | Module cooling |
Additionally |
XMP 2.0 support Dual 1.8mm thick aluminum heatsinks are used for effective cooling of memory chips Each memory module is built using anodized aluminum Matte surface prevents unwanted spots from appearing on the surface Shielded chips Special 10-layer PCB with double layer of 2oz copper provides improved electrical conductivity and signal transmission to achieve stability at high overclocking frequency Gold-plated contacts |
Color | Белый |
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